適用于切割復合材料、半導體材料、石材、石墨、陶瓷、水晶、玉石、玻璃等硬質材料，可以根據客戶要求加工定做各種規格，具有加工效率高、精度高、磨損小的特點。 Widely used of cutting composite materials,semiconductor materials,stone,graphite,ceramic,crystal,jade,glass and other hard materials.Different specifi.With the characterics of high processing efficiency,high precision,less wear.